Patent: Thick Polymer Coating of a Substrate Apparaus and Method

On July 27,2021 a new patent was granted for us, with number US 11,071,998 B2. This patent is related to a method for applying a polymer coating to a substrate wherein the resultant layer of polymer on the substrate has a substancial thickness. A mixture of polymer material, including reactor bead polymer and ground polymer, may be used in a powder coating process to achieve thicker polymer layers.